Invention Grant
- Patent Title: Electrostatic chuck assembly for plasma processing apparatus
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Application No.: US17551247Application Date: 2021-12-15
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Publication No.: US12002701B2Publication Date: 2024-06-04
- Inventor: Maolin Long
- Applicant: Mattson Technology, Inc. , Beijing E-Town Semiconductor Technology Co., Ltd.
- Applicant Address: US CA Fremont
- Assignee: Mattson Technology, Inc.,Beijing E-Town Semiconductor Technology Co., Ltd.
- Current Assignee: Mattson Technology, Inc.,Beijing E-Town Semiconductor Technology Co., Ltd.
- Current Assignee Address: US CA Fremont; CN Beijing
- Agency: Dority & Manning, P.A.
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01J37/32 ; H01L21/683
Abstract:
An electrostatic chuck including a workpiece support surface, clamping layer, heating layer, thermal control system, and sealing band is disclosed. The sealing band surrounds an outer perimeter of the electrostatic chuck including at least a portion of the workpiece surface. The sealing band has a width greater than about 3 millimeters (mm) up to about 10 mm. Plasma processing apparatuses and systems incorporating the electrostatic chuck are also provided.
Public/Granted literature
- US20220208591A1 Electrostatic Chuck Assembly for Plasma Processing Apparatus Public/Granted day:2022-06-30
Information query
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