Invention Grant
- Patent Title: Semiconductor device and method
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Application No.: US16923348Application Date: 2020-07-08
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Publication No.: US12002715B2Publication Date: 2024-06-04
- Inventor: Ya-Yi Tsai , Wei-Ting Guo , I-Wei Yang , Shu-Yuan Ku
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L21/8234 ; H01L27/088

Abstract:
A method includes forming a first fin and a second fin on a substrate; forming a dummy gate material over the first fin and the second fin; etching the dummy gate material using a first etching process to form a recess between the first fin and the second fin, wherein a sacrificial material is formed on sidewalls of the recess during the first etching process; filling the recess with an insulation material; removing the dummy gate material and the sacrificial material using a second etching process; and forming a first replacement gate over the first fin and a second replacement gate over the second fin, wherein the first replacement gate is separated from the second replacement gate by the insulation material.
Public/Granted literature
- US20210125875A1 SEMICONDUCTOR DEVICE AND METHOD Public/Granted day:2021-04-29
Information query
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