Invention Grant
- Patent Title: Heat dissipation structure, manufacturing method for heat dissipation structure, and electronic apparatus
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Application No.: US17983561Application Date: 2022-11-09
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Publication No.: US12002733B2Publication Date: 2024-06-04
- Inventor: Masahiro Kitamura , Takuroh Kamimura , Junki Hashiba , Takateru Adachi
- Applicant: Lenovo (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JP 21213311 2021.12.27
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/00 ; H01L23/367 ; H01L23/42 ; H05K1/02
Abstract:
A heat dissipation structure of an electric component that generates heat includes: a heat dissipator provided along a surface of the electric component; a liquid metal interposed between the electric component and the heat dissipator; and a fencing body interposed between the electric component and the heat dissipator in a crushed state and surrounding the liquid metal.
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