Invention Grant
- Patent Title: Reverse conducting semiconductor device and method for manufacturing reverse conducting semiconductor device
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Application No.: US17402842Application Date: 2021-08-16
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Publication No.: US12002806B2Publication Date: 2024-06-04
- Inventor: Koichi Nishi , Shinya Soneda , Takahiro Nakatani
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP 20176470 2020.10.21
- Main IPC: H01L27/07
- IPC: H01L27/07 ; H01L29/06 ; H01L29/66 ; H01L29/739 ; H01L29/861

Abstract:
The semiconductor substrate has a first principal surface and a second principal surface. The base contact layer is arranged between the base layer and the first principal surface, and forms a part of the first principal surface. The anode contact region is arranged between the anode layer and the first principal surface, forms a part of the first principal surface, and has a second conductivity type impurity concentration peak value higher than that of the anode layer. The anode contact region includes a first anode contact layer having a lower net concentration and a higher first conductivity type impurity concentration than the base contact layer.
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Information query
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