Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US17844081Application Date: 2022-06-20
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Publication No.: US12002807B2Publication Date: 2024-06-04
- Inventor: Jing-Jung Huang , Ching En Chen , Jung-Hui Kao , Kong-Beng Thei
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- The original application number of the division: US16837904 2020.04.01
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/762 ; H01L21/8234 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
A semiconductor structure includes a substrate including a first region and a second region; a first device disposed in the first region and a second device disposed in the second region; a first isolation disposed in the first region, wherein the first isolation is between a first source and a first drain, a first spacer overlaps the first isolation, the first isolation is separated from the first spacer by a first gate dielectric.
Public/Granted literature
- US20220320082A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-10-06
Information query
IPC分类: