Invention Grant
- Patent Title: Solid-state image sensor with imaging device blocks that each include imaging devices
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Application No.: US17252787Application Date: 2019-06-07
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Publication No.: US12002823B2Publication Date: 2024-06-04
- Inventor: Toshiaki Ono
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee: Sony Semiconductor Solutions Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross PC
- Priority: JP 18126651 2018.07.03
- International Application: PCT/JP2019/022709 2019.06.07
- International Announcement: WO2020/008802A 2020.01.09
- Date entered country: 2020-12-16
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N25/778 ; H10K39/32

Abstract:
A solid-state image sensor includes a plurality of imaging device blocks each including P×Q imaging devices. In an imaging device block, first charge movement controlling electrodes are provided between the imaging devices, and second charge movement controlling electrodes are provided between the imaging device blocks. In the imaging device block, P imaging devices are arrayed along a first direction, and Q imaging devices are arrayed along a second direction. Charge accumulated in a photoelectric conversion layer of the (P−1)th imaging device from the first imaging device along the first direction is transferred to the photoelectric conversion layer of the Pth imaging device and read out together with charge accumulated in the photoelectric conversion layers of the Q Pth imaging devices, under the control of the first charge movement controlling electrodes.
Public/Granted literature
- US20210265402A1 SOLID-STATE IMAGE SENSOR Public/Granted day:2021-08-26
Information query
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