Invention Grant
- Patent Title: Integrated circuits having dielectric layers including an anti-reflective coating
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Application No.: US17500096Application Date: 2021-10-13
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Publication No.: US12002846B2Publication Date: 2024-06-04
- Inventor: Poornika Fernandes , David Matthew Curran , Stephen Arlon Meisner , Bhaskar Srinivasan , Guruvayurappan S. Mathur , Scott William Jessen , Shih Chang Chang , Russell Duane Fields , Thomas Terrance Lynch
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Andrew R. Ralston; Frank D. Cimino
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L49/02
Abstract:
In some examples, an integrated circuit comprises a substrate; a first metal layer and a second metal layer positioned above the substrate; a first composite dielectric layer located on the first metal layer, wherein the first composite dielectric layer comprises a first anti-reflective coating; a second composite dielectric layer positioned on the second metal layer, wherein the second composite dielectric layer comprises a second anti-reflective coating; and a capacitor metal layer disposed over the first composite dielectric layer.
Public/Granted literature
- US20220069067A1 INTEGRATED CIRCUITS HAVING DIELECTRIC LAYERS INCLUDING AN ANTI-REFLECTIVE COATING Public/Granted day:2022-03-03
Information query
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