Invention Grant
- Patent Title: Power semiconductor device and manufacturing method thereof
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Application No.: US17373805Application Date: 2021-07-13
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Publication No.: US12002847B2Publication Date: 2024-06-04
- Inventor: Li-Ming Chang , Mei-Ling Chen , Hsu-Heng Lee
- Applicant: Invinci Semiconductor Corporation
- Applicant Address: TW Taipei
- Assignee: Invinci Semiconductor Corporation
- Current Assignee: Invinci Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agency: JCIPRNET
- Priority: CN 2011190506.5 2020.10.30
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/872

Abstract:
A power semiconductor device includes an epitaxial layer of a first conductivity type, a first doped region of a second conductivity type, a second doped region of the first conductivity type, a contact metal layer, a device electrode, a first termination electrode, and a second termination electrode. The epitaxial layer includes an active region and a termination region.
The device electrode is located in a device trench in the active region, and is electrically isolated from the epitaxial layer and the contact metal layer. The first termination electrode is located in a first termination trench in the termination region and is electrically isolated from the epitaxial layer. The second termination electrode is located at a bottom of the first termination trench and is electrically isolated from the first termination electrode and the epitaxial layer. Both the first termination electrode and the second termination electrode are capable of being selectively floating.
The device electrode is located in a device trench in the active region, and is electrically isolated from the epitaxial layer and the contact metal layer. The first termination electrode is located in a first termination trench in the termination region and is electrically isolated from the epitaxial layer. The second termination electrode is located at a bottom of the first termination trench and is electrically isolated from the first termination electrode and the epitaxial layer. Both the first termination electrode and the second termination electrode are capable of being selectively floating.
Public/Granted literature
- US20220140073A1 POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-05-05
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