Invention Grant
- Patent Title: Group-III nitride laminated substrate and semiconductor element
-
Application No.: US16952665Application Date: 2020-11-19
-
Publication No.: US12002903B2Publication Date: 2024-06-04
- Inventor: Hajime Fujikura , Taichiro Konno , Takeshi Kimura
- Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP 19211370 2019.11.22
- Main IPC: H01L33/32
- IPC: H01L33/32

Abstract:
Provided is a technology capable of improving the quality of a GaN layer that is formed on an underlying substrate. A group III-nitride laminated substrate includes an underlying substrate, a first layer that is formed on the underlying substrate and is made of aluminum nitride, and a second layer that is formed on the first layer and is made of gallium nitride. The second layer has a thickness of 10 μm or less. A half-value width of (0002) diffraction determined through X-ray rocking curve analysis is 100 seconds or less, and a half-value width of (10-12) diffraction determined through X-ray rocking curve analysis is 200 seconds or less.
Public/Granted literature
- US20210184080A1 GROUP-III NITRIDE LAMINATED SUBSTRATE AND SEMICONDUCTOR ELEMENT Public/Granted day:2021-06-17
Information query
IPC分类: