Invention Grant
- Patent Title: Light emitting module and method for manufacturing same
-
Application No.: US17280047Application Date: 2019-09-27
-
Publication No.: US12002907B2Publication Date: 2024-06-04
- Inventor: Yumiko Kameshima , Eiko Minato , Koji Taguchi , Masaaki Katsumata
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Foley & Lardner LLP
- Priority: JP 18185819 2018.09.28
- International Application: PCT/JP2019/038337 2019.09.27
- International Announcement: WO2020/067495A 2020.04.02
- Date entered country: 2021-03-25
- Main IPC: H01L33/54
- IPC: H01L33/54 ; H01L23/00 ; H01L25/075 ; H01L33/60 ; H01L33/62 ; H01L33/56

Abstract:
A light emitting module includes: a base board; and a plurality of divisional planar light emitters disposed adjacent to each other on one surface of the base board. The base board includes: a plurality of conductive parts, a flexible base part joined to the conductive parts, and an insulating base part joined to the flexible base part. Each of the plurality of divisional planar light emitters includes: a plurality of wiring parts electrically connected with corresponding ones of the conductive parts of the base board, a plurality of light emitting elements each disposed on corresponding ones of the wiring parts, and a sealing part sealing the plurality of light emitting elements and facing the insulating base part.
Public/Granted literature
- US20220037567A1 LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2022-02-03
Information query
IPC分类: