A structure includes a first face with at least one first aperture and a second face with a plurality of second apertures. The at least one first aperture is connected to the second apertures via through-holes embedded in the structure and having an electrically conducting inner wall and configured to form a waveguide medium for carrying radio frequency, RF, signals between the at least one first aperture and the plurality of second apertures. The at least one first aperture is configured to interface with at least one first external RF circuitry for processing RF signals and the plurality of the second apertures are arranged to interface with a plurality of second external RF circuitries for transmission and/or reception of RF signals. Embodiments may relate to a radio frequency, RF, communication device employing the structure.