Invention Grant
- Patent Title: Wireless interconnect for high rate data transfer
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Application No.: US17862021Application Date: 2022-07-11
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Publication No.: US12003045B2Publication Date: 2024-06-04
- Inventor: Anton Sergeevich Lukyanov , Mikhail Nikolaevich Makurin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: RU 21130597 2021.10.20
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/36 ; H01Q21/06

Abstract:
The disclosure refers to a wireless system for high rate data transfer. The technical result consists in high rate data transfer, improved reliability of the wireless data transfer system, as well as reducing its complexity and size. A wireless data transfer system is provided. The wireless data transfer system includes two antenna structures separated from each other by a gap, each antenna structure including a printed circuit board on which at least one antenna is located, wherein dummy elements are located around each of the at least one antenna, each dummy element being connected to a load.
Public/Granted literature
- US20230123113A1 WIRELESS INTERCONNECT FOR HIGH RATE DATA TRANSFER Public/Granted day:2023-04-20
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