Invention Grant
- Patent Title: Hybrid RF integrated circuit device
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Application No.: US17022221Application Date: 2020-09-16
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Publication No.: US12003220B2Publication Date: 2024-06-04
- Inventor: Lei Zhao , Greg Durnan , Abdulrhman M. S. Ahmed
- Applicant: MACOM Technology Solutions Holdings, Inc.
- Applicant Address: US MA Lowell
- Assignee: MACOM Technology Solutions Holdings, Inc.
- Current Assignee: MACOM Technology Solutions Holdings, Inc.
- Current Assignee Address: US MA Lowell
- Agency: COATS & BENNETT, PLLC
- Main IPC: H03F3/195
- IPC: H03F3/195 ; H03F1/02

Abstract:
The present disclosure relates to an RF amplifier device including an IC chip including at least one transistor formed on a substrate, at least one operational circuit formed on the substrate and electrically coupled to the transistor, and a port configured to electrically couple the at least one operational circuit with operational circuitry outside the IC chip to adjust operation of the operational circuitry.
Public/Granted literature
- US20220085771A1 Hybrid RF Integrated Circuit Device Public/Granted day:2022-03-17
Information query
IPC分类: