Invention Grant
- Patent Title: Bootstrapped switch
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Application No.: US18098132Application Date: 2023-01-18
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Publication No.: US12003234B2Publication Date: 2024-06-04
- Inventor: Liang-Huan Lei
- Applicant: REALTEK SEMICONDUCTOR CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Priority: TW 1106388 2022.02.22
- Main IPC: H03K17/687
- IPC: H03K17/687

Abstract:
A bootstrapped switch includes a sampling transistor, a bootstrapped circuit, and a buffer circuit. The sampling transistor is configured to be selectively turned on according to a level of a control node, in order to transmit an input signal from a first terminal of the sampling transistor to a second terminal of the sampling transistor, in which a body of the sampling transistor is configured to receive a buffer signal. The bootstrapped circuit is configured to pull up the level of the control node, such that a constant voltage difference is present between the control node and the first terminal of the sampling transistor during a turn-on interval of the sampling transistor. The buffer circuit is configured to generate the buffer signal according to the input signal.
Public/Granted literature
- US20230268920A1 BOOTSTRAPPED SWITCH Public/Granted day:2023-08-24
Information query
IPC分类: