Invention Grant
- Patent Title: Multilayer board
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Application No.: US17514211Application Date: 2021-10-29
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Publication No.: US12004290B2Publication Date: 2024-06-04
- Inventor: Nobuyuki Tenno , Nobuo Ikemoto , Takahiro Baba
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP 19128610 2019.07.10
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01P3/08

Abstract:
In a multilayer board, a transmission line includes layers including a first insulator layer, a first joining material layer in contact with a first surface of the first insulator layer, and a second joining material layer in contact with a second surface of the first insulator layer. A signal conductor of the transmission line is on the first surface of the first insulator layer, a relative permittivity of the second joining material layer is lower than a relative permittivity of the first joining material layer, and an adhesion strength between the first insulator layer and the first joining material layer is higher than an adhesion strength between the first insulator layer and the second joining material layer.
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