Invention Grant
- Patent Title: Interfaces for coupling a memory module to a circuit board, and associated devices, modules, and systems
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Application No.: US17804789Application Date: 2022-05-31
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Publication No.: US12004314B2Publication Date: 2024-06-04
- Inventor: Anthony D. Veches
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01R12/70 ; H05K5/02 ; H05K7/20 ; H05K1/14

Abstract:
This disclosure relates generally to interfaces between memory modules and circuit boards. More specifically, this disclosure relates to interfaces for coupling a memory module to a circuit board such that the memory module is arranged in a plane that is substantially parallel with a plane of the circuit board. Various embodiments disclosed herein include interfaces, memory modules including interfaces or portions of interfaces, and/or circuit boards including interfaces and/or portions of interfaces. Associated devices and systems are also disclosed.
Public/Granted literature
- US20230389207A1 INTERFACES FOR COUPLING A MEMORY MODULE TO A CIRCUIT BOARD, AND ASSOCIATED DEVICES, MODULES, AND SYSTEMS Public/Granted day:2023-11-30
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