A device of drawing out surface heat of an electronic component includes a housing, a liquid inlet port, a liquid outlet port, a partition wall and flow guiding walls. The housing includes opposite a contact wall and a heat dissipating wall, and a side wall respectively connected to the contact wall and the heat dissipating wall. The liquid inlet port and the liquid outlet port are formed on the side wall. The partition wall is formed in the housing, and connected to inner surfaces of the contact wall, the heat dissipating wall and the side wall, to divide an interior of the housing into an inflow channel and an outflow channel. The flow guiding walls are respectively formed in the inflow channel and the out flow channel, and connected to the inner surface of the contact wall.