A low inductance power module with low power loop inductance and high-power density is provided. The power module may include a vertical power loop structure, a cooling layer, and a thermal dissipation structure. The vertical power loop structure may utilize a substrate bottom conduction layer for electrical conduction. The thermal dissipation structure may be disposed between the substrate bottom conduction layer and the cooling layer. The vertical power loop structure may include integrated decoupling capacitors. Alternatively, the structure may include no integrated decoupling capacitors. The vertical power loop structure may include one or more half-bridge structures connected in parallel, each with its own integrated decoupling capacitors. The vertical power loop structure reduces power loop inductance in the power module, and the thermal dissipation structure provides electrical insulation, mechanical support, and thermal conduction.