Invention Grant
- Patent Title: Recessed channel fin integration
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Application No.: US17886917Application Date: 2022-08-12
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Publication No.: US12004341B2Publication Date: 2024-06-04
- Inventor: Sangmin Hwang , Si-Woo Lee
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
A variety of applications can include apparatus having a recessed channel FinFET. The recessed channel FinFET can include one or more fin structures between the source region and the drain region, where the one or more fin structures are recessed from a top level of the source region and from a top level of the drain region. The recessed channel FinFET can include a gate recessed from the top level of a source region and a drain region, where the gate can be separated from tip regions of the fin structures by a gate dielectric defining a channel between the source region and the drain region. Recessed channel FinFETs can be structured in a periphery to an array of a memory device and can be fabricated in a process merged with forming access lines to the array.
Public/Granted literature
- US20240057317A1 RECESSED CHANNEL FIN INTEGRATION Public/Granted day:2024-02-15
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