Invention Grant
- Patent Title: Earmuffs
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Application No.: US17030719Application Date: 2020-09-24
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Publication No.: US12004924B2Publication Date: 2024-06-11
- Inventor: Toshiyuki Himuro , Hiroshi Uchida
- Applicant: JVCKENWOOD Corporation
- Applicant Address: JP Yokohama
- Assignee: JVCKENWOOD CORPORATION
- Current Assignee: JVCKENWOOD CORPORATION
- Current Assignee Address: JP Yokohama
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP 19184902 2019.10.08
- Main IPC: A61F11/14
- IPC: A61F11/14 ; H04R1/10

Abstract:
Earmuffs include a bowl-shaped housing base having a first engagement portion, an annular plate-shaped base plate having a second engagement portion on one side and a third engagement portion on the other side, and is integrated with the housing base by causing the second engagement portion to be engaged with the first engagement portion, and a pad portion that includes a pad fixed on one side and a pad base having a fourth engagement portion on the other side, and is integrated with the base plate by causing the fourth engagement portion to be engaged with the third engagement portion. The base plate has a groove portion adjacent to the third engagement portion and the pad base has a rib that enters the groove portion. The rib enters the groove portion and restricts an inclination of the third engagement portion involved with an engagement with the fourth engagement portion.
Public/Granted literature
- US20210100689A1 EARMUFFS Public/Granted day:2021-04-08
Information query
IPC分类: