Invention Grant
- Patent Title: Method for shaping three-dimensional shaped object
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Application No.: US16802076Application Date: 2020-02-26
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Publication No.: US12005506B2Publication Date: 2024-06-11
- Inventor: Kenta Anegawa , Daizo Aoyagi
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: CHIP LAW GROUP
- Priority: JP 19033677 2019.02.27
- Main IPC: B29C64/106
- IPC: B29C64/106 ; B22D23/00 ; B22F3/24 ; B22F10/18 ; B22F10/22 ; B22F10/50 ; B22F10/66 ; B22F10/80 ; B22F12/13 ; B22F12/53 ; B28B1/00 ; B29C64/188 ; B29C64/209 ; B33Y10/00 ; B33Y30/00 ; B33Y40/00 ; B22F12/17

Abstract:
Provided is a method for shaping a three-dimensional shaped object using a cutting tool configured to perform cutting at a first length at maximum in a predetermined cutting direction, the method including: a first section shaping step of shaping a first section having a length in a first direction shorter than the first length by laminating a shaping material; a first section cutting step of cutting the first section with the cutting tool having a cutting direction along the first direction; a second section shaping step of shaping a second section having a length in a second direction shorter than the first length by laminating the shaping material, to connect to a first end surface of the first section in the first direction; and a second section cutting step of cutting the second section along the second direction with the cutting tool having a cutting direction along the second direction.
Public/Granted literature
- US20200269502A1 METHOD FOR SHAPING THREE-DIMENSIONAL SHAPED OBJECT Public/Granted day:2020-08-27
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