Invention Grant
- Patent Title: Cutting tool
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Application No.: US18039969Application Date: 2022-10-14
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Publication No.: US12005510B2Publication Date: 2024-06-11
- Inventor: Haruyo Fukui , Nozomi Tsukihara , Anongsack Paseuth , Toshihiro Tabata
- Applicant: Sumitomo Electric Industries, Ltd.
- Applicant Address: JP Osaka
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: XSENSUS LLP
- International Application: PCT/JP2022/038392 2022.10.14
- Date entered country: 2023-06-02
- Main IPC: B23B27/14
- IPC: B23B27/14 ; C23C14/06 ; C23C28/00

Abstract:
A cutting tool is a cutting tool comprising a substrate and a coating film disposed on the substrate, in which the coating film includes a first layer, the first layer is composed of an alternate layer where a first unit layer and a second unit layer are alternately stacked, the first unit layer is composed of AlaCr1-a-bCebN, a is more than 0.500 and 0.800 or less, b is 0.001 or more and 0.100 or less, the second unit layer is composed of AlcV1-cN, c is 0.30 or more and 0.75 or less, and a and c satisfy a relationship of a>c.
Public/Granted literature
- US20240123514A1 CUTTING TOOL Public/Granted day:2024-04-18
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