Invention Grant
- Patent Title: Three-dimensional shaping device and three-dimensional shaping method
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Application No.: US16644916Application Date: 2018-09-03
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Publication No.: US12005635B2Publication Date: 2024-06-11
- Inventor: Yuichiro Nakayama , Daiki Hayashi
- Applicant: IHI Corporation
- Applicant Address: JP Tokyo
- Assignee: IHI CORPORATION
- Current Assignee: IHI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JP 17171293 2017.09.06
- International Application: PCT/JP2018/032642 2018.09.03
- International Announcement: WO2019/049832A 2019.03.14
- Date entered country: 2020-03-05
- Main IPC: B29C64/153
- IPC: B29C64/153 ; B29C64/227 ; B29C64/245 ; B29C64/268 ; B29C64/314 ; B33Y10/00 ; B33Y30/00 ; B33Y40/10

Abstract:
A three-dimensional shaping device shapes a three-dimensional article by irradiating a powder material with an electron beam and melting the powder material. The three-dimensional shaping device includes an electron beam emitting unit emitting the electron beam, melting the powder material in order to shape the article, and performing preliminary heating of the powder material by irradiating the powder material with the electron beam before the article is shaped. The electron beam emitting unit moves an irradiation position of the electron beam in a spiral pattern when the powder material is irradiated with the electron beam for preliminary heating.
Public/Granted literature
- US20200262137A1 THREE-DIMENSIONAL SHAPING DEVICE AND THREE-DIMENSIONAL SHAPING METHOD Public/Granted day:2020-08-20
Information query
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