A UAV heatsink assembly including two heat pipes, a first and second heat pipes including transfer and end portions, the end portions thermally connected to first and second metallic heat transfer elements, and a third metallic heat transfer element thermally connected to opposite ends of the heat pipes. A CPU thermally connected to the third metallic heat transfer element with first and second electrically insulating thermoplastic elements into which the respective first and second metallic components fit where the first and second electrically insulating thermoplastic elements are not between an outside ambient environment and the first and second metallic components. The heat pipes each include a wick structure and an embedded liquid providing thermal transport therein while at least some of the embedded liquids are above a threshold temperature between −40° C. and 70° C. such that the UAV is at least operable above −40° C. degrees and below 70° C.