Invention Grant
- Patent Title: Thermoplastic resin composition
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Application No.: US17051740Application Date: 2019-09-11
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Publication No.: US12006429B2Publication Date: 2024-06-11
- Inventor: Seo Hwa Kim , Byoung Il Kang , Eun Jung Choi , Taek Jun Jung , Jeong In Cho , Dong Kun Shin
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Priority: KR 20180113966 2018.09.21 KR 20190110895 2019.09.06
- International Application: PCT/KR2019/011840 2019.09.11
- International Announcement: WO2020/060110A 2020.03.26
- Date entered country: 2020-10-29
- Main IPC: C08L55/02
- IPC: C08L55/02 ; C08L25/12 ; C08L33/20

Abstract:
The present invention provides a thermoplastic resin composition which includes: a first copolymer including a core including a conjugated diene-based polymer and a shell including an aromatic vinyl-based monomer unit and a vinyl cyan-based monomer unit; and a second copolymer including an aromatic vinyl-based monomer unit and a vinyl cyan-based monomer unit, wherein the first copolymer has a degree of grafting of 32 to 50%, the second copolymer has a weight-average molecular weight of 85,000 to 115,000 g/mol, and the thermoplastic resin composition includes the first copolymer at 30 wt % or less and an oligomer residue at 1.1 wt % or less. Specifically, the thermoplastic resin composition can shorten an injection molding time.
Public/Granted literature
- US20210238407A1 THERMOPLASTIC RESIN COMPOSITION Public/Granted day:2021-08-05
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