Invention Grant
- Patent Title: Thermal management in integrated circuit packages
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Application No.: US16533235Application Date: 2019-08-06
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Publication No.: US12007170B2Publication Date: 2024-06-11
- Inventor: Feras Eid , Telesphor Kamgaing , Georgios Dogiamis , Aleksandar Aleksov , Johanna M. Swan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Akona IP PC
- Main IPC: F28D15/04
- IPC: F28D15/04 ; H01L23/367 ; H01L23/38 ; H01L23/427
Abstract:
Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.
Public/Granted literature
- US20210041182A1 THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES Public/Granted day:2021-02-11
Information query
