Invention Grant
- Patent Title: Heat sink
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Application No.: US17573660Application Date: 2022-01-12
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Publication No.: US12007172B2Publication Date: 2024-06-11
- Inventor: Po-Shen Wang , Hsin-Tzu Kuo
- Applicant: YI CHANG CO., LTD. , Po-Shen Wang , Hsin-Tzu Kuo
- Applicant Address: TW New Taipei
- Assignee: YI CHANG CO., LTD.
- Current Assignee: YI CHANG CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: WPAT, P.C
- Priority: TW 0102154 2021.01.20
- Main IPC: F28D15/04
- IPC: F28D15/04

Abstract:
A heat sink includes a casing and a capillary structure. The casing includes a chamber filled with a working fluid. The capillary structure is located in the chamber. The capillary structure includes a plurality of capillary pores of different diameters. The capillary structure includes at least one supporting portion connected to a substrate. The substrate and the at least one supporting portion abut two opposite inner faces of the casing, respectively.
Public/Granted literature
- US20220228812A1 Heat Sink Public/Granted day:2022-07-21
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