Invention Grant
- Patent Title: Substrate and material characterisation method and device
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Application No.: US17441039Application Date: 2020-02-07
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Publication No.: US12007424B2Publication Date: 2024-06-11
- Inventor: Kamal Samanta
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Atsugi
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Atsugi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: GB 04448 2019.03.29
- International Application: PCT/GB2020/050284 2020.02.07
- International Announcement: WO2020/201679A 2020.10.08
- Date entered country: 2021-09-20
- Main IPC: G01R27/26
- IPC: G01R27/26 ; H01P3/12

Abstract:
A device comprises a planar substrate having conductive formations defining a substrate integrated waveguide test resonator; the test resonator comprising a three-dimensional region formed at least partly within the substrate having first and second planar conductive layers extending parallel to the plane of the substrate and one or more conductive sidewall formations perpendicular to the plane of the substrate defining a resonator side wall extending around the three-dimensional region; in which one of the first and second planar conductive layers comprises a test port comprising a conductive test connection electrically isolated from the rest of that planar conductive layer.
Public/Granted literature
- US20220214390A1 SUBSTRATE AND MATERIAL CHARACTERISATION METHOD AND DEVICE Public/Granted day:2022-07-07
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