Invention Grant
- Patent Title: Method of bonding substrates utilizing a substrate holder with holding fingers
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Application No.: US18119909Application Date: 2023-03-10
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Publication No.: US12009231B2Publication Date: 2024-06-11
- Inventor: Jun-hyung Kim , Sung-hyup Kim , Tae-yeong Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20180103029 2018.08.30
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/66 ; H01L21/673 ; H01L21/687 ; H01L23/00 ; H01L25/00 ; H01L27/146
Abstract:
A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.
Public/Granted literature
- US12051601B2 Method of bonding substrates utilizing a substrate holder with holding fingers Public/Granted day:2024-07-30
Information query
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