A semiconductor package includes a substrate, first and second semiconductor chip structures on the substrate and spaced apart from each other in a first horizontal direction, a mold layer on the substrate and covering both the first and second semiconductor chip structures, and a supporting structure on the mold layer and distal from the upper surface of the substrate than both the first and second semiconductor chip structures in a vertical direction. The supporting structure includes first and second supporting portions, spaced apart from each other in a second horizontal direction that is perpendicular to the first horizontal direction and the vertical direction. Each of the first and second supporting portions has a bar shape or a linear shape extending in the first horizontal direction. At least one of the first supporting portion or the second supporting portion overlaps the first and second semiconductor chips in the vertical direction.