Invention Grant
- Patent Title: Solid-state imaging device and electronic apparatus
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Application No.: US17250237Application Date: 2019-04-03
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Publication No.: US12009378B2Publication Date: 2024-06-11
- Inventor: Tetsuya Yamaguchi
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 18124550 2018.06.29
- International Application: PCT/JP2019/014799 2019.04.03
- International Announcement: WO2020/003681A 2020.01.02
- Date entered country: 2020-12-21
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H04N25/70

Abstract:
To provide a solid-state imaging device capable of improving image quality and an electronic apparatus equipped with the solid-state imaging device. There is provided a solid-state imaging device including a pixel array unit in which a plurality of pixels is one-dimensionally or two-dimensionally arrayed, the pixel array unit including a color filter and a semiconductor substrate for each pixel, a partition layer being formed between the color filters, the partition layer having a first width and a second width in order from a light incident side, the first width and the second width being different, and the second width being larger than the first width, and there is further provided an electronic apparatus equipped with the solid-state imaging device.
Public/Granted literature
- US20210126031A1 SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2021-04-29
Information query
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