Invention Grant
- Patent Title: Laser processing apparatus, laser processing method, and method for manufacturing semiconductor device
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Application No.: US16768681Application Date: 2018-10-30
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Publication No.: US12011777B2Publication Date: 2024-06-18
- Inventor: Yoshihiro Yamaguchi , Miki Sawai , Sadao Tanigawa , Hirotaka Sazuka , Naoyuki Kobayashi
- Applicant: JSW AKTINA SYSTEM CO., LTD.
- Applicant Address: JP Yokohama
- Assignee: JSW AKTINA SYSTEM CO., LTD
- Current Assignee: JSW AKTINA SYSTEM CO., LTD
- Current Assignee Address: JP Yokohama
- Agency: Potomac Law Group, PLLC
- Priority: JP 18002460 2018.01.11
- International Application: PCT/JP2018/040223 2018.10.30
- International Announcement: WO2019/138659A 2019.07.18
- Date entered country: 2020-05-31
- Main IPC: B23K26/03
- IPC: B23K26/03 ; B23K26/50 ; B23K101/40 ; H01L21/268

Abstract:
A laser processing apparatus (1) according to an embodiment includes a processing chamber (18) configured to perform laser processing for an object to be processed (40), a stage (10) disposed inside the processing chamber (18), the stage being configured to convey the object to be processed (40), and a control unit (50) configured to instruct a loading/unloading apparatus (30) about a placement position of the object to be processed (40) over the stage (10), the loading/unloading apparatus (30) being configured to load/unload the object to be processed (40) into/from the processing chamber (18). Further, the processing chamber (18) includes a loading gate (17a) for loading and an unloading gate (17b) for unloading for the object to be processed (40), and the object to be processed (40) is conveyed only in a first direction from the loading gate (17a) toward the unloading gate (17b) over the stage (10).
Public/Granted literature
- US20210187659A1 LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2021-06-24
Information query
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