Invention Grant
- Patent Title: Floor panel
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Application No.: US18155979Application Date: 2023-01-18
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Publication No.: US12012764B2Publication Date: 2024-06-18
- Inventor: Laurent Meersseman , Martin Segaert
- Applicant: FLOORING INDUSTRIES LIMITED, SARL
- Applicant Address: LU Bertrange
- Assignee: UNILIN BV
- Current Assignee: UNILIN BV
- Current Assignee Address: BE Wielsbeke
- Agency: Workman Nydegger
- Priority: BE 100283 2010.05.10
- The original application number of the division: US13696769
- Main IPC: B29C48/21
- IPC: B29C48/21 ; B32B3/06 ; B32B3/12 ; B32B5/14 ; B32B5/18 ; B32B7/02 ; B32B7/12 ; B32B21/02 ; B32B27/06 ; B32B27/08 ; B32B27/20 ; B32B27/30 ; B32B27/40 ; B32B37/06 ; B32B37/15 ; B32B37/16 ; B32B37/22 ; B44C1/24 ; B44C5/04 ; E04F15/02 ; E04F15/10 ; E04F15/18 ; B29C48/17 ; B29C48/19 ; B29C65/00 ; B29C65/56 ; B29C65/72 ; B29C65/78 ; B32B38/00

Abstract:
A floor may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly adhered to the substrate by heat welding the printed thermoplastic film and the top side of the substrate, in the absence of a glue layer. The substrate may be a synthetic material board including a filler. The substrate at least at two opposite edges may include coupling means provided in the synthetic material board. The thermoplastic transparent or translucent layer may be provided with a structure.
Public/Granted literature
- US20230151617A1 FLOOR PANEL Public/Granted day:2023-05-18
Information query
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