Invention Grant
- Patent Title: Heater substrate, probe card substrate, and probe card
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Application No.: US17799698Application Date: 2021-02-09
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Publication No.: US12013433B2Publication Date: 2024-06-18
- Inventor: Daisuke Jingu , Hidenori Tanaka
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JP 20024821 2020.02.18
- International Application: PCT/JP2021/004702 2021.02.09
- International Announcement: WO2021/166732A 2021.08.26
- Date entered country: 2022-08-15
- Main IPC: G01R31/28
- IPC: G01R31/28 ; G01R1/073 ; H05B1/02 ; H05B3/03 ; H05B3/18 ; H05B3/28

Abstract:
A heater substrate has an insulating substrate having a first surface and a second surface on the opposite side relative to the first surface and at least one heating element of spiral shape including plural heater wire pieces and positioned in or on the insulating substrate. The heating element of spiral shape has at least one adjustment section including a turn of all or some of the plural heater wire pieces. The plural heater wire pieces include a first heater wire piece and a second heater wire piece adjacent to the inner side of the first heater wire piece. In the adjustment section, the length of the first heater wire piece is smaller than the length of the second heater wire piece.
Public/Granted literature
- US20230084616A1 HEATER SUBSTRATE, PROBE CARD SUBSTRATE, AND PROBE CARD Public/Granted day:2023-03-16
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