Invention Grant
- Patent Title: High-speed active contact
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Application No.: US17540692Application Date: 2021-12-02
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Publication No.: US12013584B2Publication Date: 2024-06-18
- Inventor: Benjamin Michael Grab , Henry Burton Piper, III , Soren Grinderslev
- Applicant: TE Connectivity Solutions GmbH
- Applicant Address: CH Schaffhausen
- Assignee: TE Connectivity Solutions GmbH
- Current Assignee: TE Connectivity Solutions GmbH
- Current Assignee Address: CH Schaffhausen
- Main IPC: H04B10/00
- IPC: H04B10/00 ; G02B6/42 ; H05K1/18

Abstract:
A contact comprising: (a) a contact housing, said contact housing being narrower than a cavity of a connector such that said contact housing is laterally movable within said cavity; (b) an optical interface for receiving a ferrule of a mating connector contact; (c) optoelectrical circuitry optically connected to said optical interface, wherein said optical interface and said optoelectrical circuitry are held rigidly in relation to each other within said contact housing; and (d) an electrical interface electrically connected to said optoelectrical circuitry and configured for electrical connection to a circuit board, wherein said electrical interface comprising at least a flexible cable to provide compliance between said optoelectrical circuitry and said circuit board.
Public/Granted literature
- US20230176305A1 HIGH-SPEED ACTIVE CONTACT Public/Granted day:2023-06-08
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