Invention Grant
- Patent Title: Printed wiring
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Application No.: US17370461Application Date: 2021-07-08
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Publication No.: US12014012B2Publication Date: 2024-06-18
- Inventor: Akitoshi Sakaue
- Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Applicant Address: JP Tokyo
- Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
- Current Assignee Address: JP Tokyo
- Agency: GREENBLUM & BERNSTEIN, P.L.C.
- Priority: JP 16201536 2016.10.13
- Main IPC: G06F3/044
- IPC: G06F3/044 ; G06F3/041 ; H05K1/09 ; H05K3/12

Abstract:
In printed wiring that is formed, on a surface of a base member, by a film of cured electrically conductive ink and that includes: a wavy line; a first wiring element located at one side of both sides sandwiching the wavy line in a width direction; and a second wiring element located at the other side of the both sides and adjacently to the wavy line; a surplus wavy line is provided which is another wavy line, which extends along the wavy line adjacently to the wavy line between the wavy line and the first wiring element, and which is connected to the wavy line to have the same potential.
Public/Granted literature
- US20210333939A1 PRINTED WIRING Public/Granted day:2021-10-28
Information query