A stacked memory includes a volatile memory die and a non-volatile memory die that are stacked together. The non-volatile memory die includes a non-volatile storage array and a peripheral circuit. The peripheral circuit includes a power integrity circuit and a signal integrity circuit. The power integrity circuit is configured to perform power integrity optimization on a power supply obtained from a lower-layer die and then transmit the power supply to an upper-layer die. The signal integrity circuit is configured to perform signal integrity optimization on a signal obtained from a lower-layer die and then transmit the signal to an upper-layer die.