Invention Grant
- Patent Title: Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
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Application No.: US17328563Application Date: 2021-05-24
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Publication No.: US12015000B2Publication Date: 2024-06-18
- Inventor: Bora Baloglu , Curtis Zwenger , Ron Huemoeller
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/00 ; H01L25/00 ; H01L25/10 ; H01L25/065
Abstract:
A structure and method for performing metal-to-metal bonding in an electrical device. For example and without limitation, various aspects of this disclosure provide a structure and method that utilize an interlocking structure configured to enhance metal-to-metal bonding.
Public/Granted literature
- US20210280542A1 SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2021-09-09
Information query
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