Invention Grant
- Patent Title: Image sensor module and camera module including the same
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Application No.: US17592925Application Date: 2022-02-04
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Publication No.: US12015044B2Publication Date: 2024-06-18
- Inventor: Kang Jin Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR 20210136551 2021.10.14
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G02B5/20 ; H01L23/00 ; H04N23/51 ; H04N23/55
Abstract:
An image sensor module includes an image sensor and a substrate on which the image sensor is disposed, wherein a step portion is provided on an upper surface of the substrate, an accommodation portion in which the image sensor is disposed is provided at the step portion, the image sensor is connected to the substrate by a bonding wire, and the bonding wire is covered with a bonding portion.
Public/Granted literature
- US20230121510A1 IMAGE SENSOR MODULE AND CAMERA MODULE INCLUDING THE SAME Public/Granted day:2023-04-20
Information query
IPC分类:
