Invention Grant
- Patent Title: Thin film structure including dielectric material layer and electronic device including the same
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Application No.: US17984877Application Date: 2022-11-10
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Publication No.: US12015073B2Publication Date: 2024-06-18
- Inventor: Woojin Lee , Kiyoung Lee , Yongsung Kim , Eunsun Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190096915 2019.08.08
- Main IPC: H01L29/51
- IPC: H01L29/51 ; C01G23/00 ; C01G35/00 ; H10B51/00 ; H10B53/00

Abstract:
A thin film structure including a dielectric material layer and an electronic device to which the thin film structure is applied are provided. The dielectric material layer includes a compound expressed by ABO3, wherein at least one of A and B in ABO3 is substituted and doped with another atom having a larger atom radius, and ABO3 becomes A1-xA′xB1-yB′yO3 (where x>=0, y>=0, at least one of x and y≠0, a dopant A′ has an atom radius greater than A and/or a dopant B′ has an atom radius greater than B) through substitution and doping. A dielectric material property of the dielectric material layer varies according to a type of a substituted and doped dopant and a substitution doping concentration.
Public/Granted literature
- US20230074895A1 THIN FILM STRUCTURE INCLUDING DIELECTRIC MATERIAL LAYER AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2023-03-09
Information query
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