Invention Grant
- Patent Title: Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor
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Application No.: US17892788Application Date: 2022-08-22
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Publication No.: US12015110B2Publication Date: 2024-06-18
- Inventor: Iwan-Wahyu Saputra , Yeow-Meng Teo
- Applicant: LUMILEDS LLC
- Applicant Address: US CA San Jose
- Assignee: Lumileds LLC
- Current Assignee: Lumileds LLC
- Current Assignee Address: US CA San Jose
- Agency: Volpe Koenig
- Priority: EP 160421 2016.03.15
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/46 ; H01L33/48 ; H01L33/50 ; H01L33/56

Abstract:
An array of light emitting devices is mounted on a support surface with the transparent growth substrate (e.g., sapphire) facing up. A photoresist layer is then deposited over the top surface of the growth substrate, followed by depositing a reflective material over the top and side surfaces of the light emitting devices to encapsulate the light emitting devices. The top surfaces of the light emitting devices are then ground down to remove the reflective material over the top surface of the photoresist. The photoresist is then dissolved to leave a cavity over the growth substrate having reflective walls. The cavity is then filled with a phosphor. The phosphor-converted light emitting devices are then singulated to form packaged light emitting devices. All side light is reflected back into the light emitting device by the reflective material and eventually exits the light emitting device toward the phosphor. The packaged light emitting devices, when energized, appear as a white dot with no side emission (e.g., no blue halo).
Public/Granted literature
- US12057535B2 Flip chip LED with side reflectors encasing side surfaces of a semiconductor structure and phosphor Public/Granted day:2024-08-06
Information query
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