Invention Grant
- Patent Title: Semiconductor device, communication system, and method of manufacturing semiconductor device
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Application No.: US17846014Application Date: 2022-06-22
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Publication No.: US12015204B2Publication Date: 2024-06-18
- Inventor: Hiroji Akahori
- Applicant: LAPIS Semiconductor Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: LAPIS Semiconductor Co., Ltd.
- Current Assignee: LAPIS Semiconductor Co., Ltd.
- Current Assignee Address: JP Yokohama
- Agency: JCIPRNET
- Priority: JP 16117405 2016.06.13
- The original application number of the division: US15603468 2017.05.24
- Main IPC: H01Q1/22
- IPC: H01Q1/22 ; H01L23/66 ; H01Q1/24 ; H01Q1/48 ; H01Q21/00 ; H01Q21/29

Abstract:
A semiconductor device includes a semiconductor chip, a first antenna element and a second antenna element. The semiconductor chip includes a communication circuit. The first antenna element includes a line pattern which is electrically connected to the communication circuit and meanderingly reciprocates in a first direction parallel to a first surface of the semiconductor chip. The second antenna element includes a line pattern which is electrically connected to the communication circuit and meanderingly reciprocates in a second direction parallel to a second surface opposite to the first surface of the semiconductor chip.
Public/Granted literature
- US20220320749A1 SEMICONDUCTOR DEVICE, COMMUNICATION SYSTEM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2022-10-06
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