A laser module includes an optical assembly, a laser chip disposed on a side of the optical assembly, a power supply structure, a packaging structure and a heat dissipation structure. The power supply structure includes a first electrode and a second electrode both connected to the laser chip. An accommodating cavity is formed in the packaging structure, and the optical assembly is at least partially received in the accommodating cavity. The heat dissipation structure is sleeved on an outer side of the packaging structure, and abuts against the first electrode and the second electrode.