Invention Grant
- Patent Title: IC with first and second functional circuits coupling only first circuits to output bond pads
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Application No.: US17576376Application Date: 2022-01-14
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Publication No.: US12015405B2Publication Date: 2024-06-18
- Inventor: H. Pooya Forghani-zadeh , George Vincent Konnail , Christopher Adam Opoczynski
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent John R. Pessetto; Frank D. Cimino
- The original application number of the division: US15635998 2017.06.28
- Main IPC: H03K19/1776
- IPC: H03K19/1776 ; H03K19/0175 ; H03K19/173

Abstract:
A family of digital logic functions has the same specifications for input and output voltages and the same number of bond pads. A digital logic integrated circuit for the family includes a substrate of semiconductor material having a core area and a peripheral area; a certain number of bond pads formed in the peripheral area, the certain number of bond pads determining the total area of the substrate; programmable digital logic transistor circuitry formed in the core area for each of the digital logic functions in the family; programmable input and output circuitry formed in the peripheral area; programming circuitry for programming the programmable digital logic transistor circuitry into a selected digital logic function; and programmable input and output means for programming the input and output circuitry into input and output circuits for the selected digital logic function.
Public/Granted literature
- US20220140830A1 IC WITH FIRST AND SECOND FUNCTIONAL CIRCUITS COUPLING ONLY FIRST CIRCUITS TO OUTPUT BOND PADS Public/Granted day:2022-05-05
Information query
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