Invention Grant
- Patent Title: Laminate, method for producing laminate, structure provided with laminate, and method for protecting or repairing structure
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Application No.: US17285446Application Date: 2019-09-04
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Publication No.: US12020675B2Publication Date: 2024-06-25
- Inventor: Masayuki Ohishi
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Caesar Rivise, PC
- Priority: JP 18197027 2018.10.18
- International Application: PCT/JP2019/034869 2019.09.04
- International Announcement: WO2020/079980A 2020.04.23
- Date entered country: 2021-04-14
- Main IPC: G10K11/168
- IPC: G10K11/168 ; B32B7/12 ; B32B27/08 ; B32B27/18 ; B32B27/30
Abstract:
A laminate including at least layers A to C in this order, wherein an integrated value from 0 mm to 50 mm of displacement calculated from a load-displacement diagram obtained by carrying out a tensile property test method is 1.0 Nm (=J) or more; and an adhesive strength between the layer B and the layer C is 10 N/25 mm or more.
Public/Granted literature
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