Invention Grant
- Patent Title: Coil component
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Application No.: US17115311Application Date: 2020-12-08
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Publication No.: US12020854B2Publication Date: 2024-06-25
- Inventor: Hitoshi Ohkubo , Miyuki Asai , Masazumi Arata , Hokuto Eda
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP 19223911 2019.12.11
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F17/04

Abstract:
In a coil component, the pressure resistance is improved by main surfaces and of a main body portion being covered with an insulating layer. The main body portion has a surface part, the resin ratio of the surface part is higher than the internal resin ratio, and insulation is enhanced at the surface part. As a result, the pressure resistance on the surface of the main body portion is further improved and the pressure resistance of the entire coil component is further improved.
Public/Granted literature
- US20210183566A1 COIL COMPONENT Public/Granted day:2021-06-17
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