Invention Grant
- Patent Title: Subtractive patterning of interconnect structures
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Application No.: US17447388Application Date: 2021-09-10
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Publication No.: US12020949B2Publication Date: 2024-06-25
- Inventor: Dominik Metzler , Somnath Ghosh , John Christopher Arnold , Ekmini Anuja De Silva
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Stosch Sabo
- Main IPC: H01L21/3213
- IPC: H01L21/3213 ; H01L21/768 ; G06F30/3953
Abstract:
A method of making a back-end-of-line (BEOL) component includes filling spaces in a layer of metal material and a layer of hardmask material with a layer of scaffolding material. The method further includes forming at least one plug on top of the layer of metal material such that the at least one plug is integrally formed with the layer of scaffolding material. The method further includes removing the layer of hardmask material such that a top surface of the layer of metal material is exposed except where the at least one plug is formed on top of the layer of metal material. The method further includes recessing the layer of metal material where the top surface of the layer of metal material is exposed. The method further includes removing the scaffolding material.
Public/Granted literature
- US20230084739A1 SUBTRACTIVE PATTERNING OF INTERCONNECT STRUCTURES Public/Granted day:2023-03-16
Information query
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