Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US16968875Application Date: 2020-06-30
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Publication No.: US12021122B2Publication Date: 2024-06-25
- Inventor: Anbang Zhang , King Yuen Wong
- Applicant: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Applicant Address: CN Zhuhai
- Assignee: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Current Assignee: INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Zhuhai
- Agency: JCIPRNET
- International Application: PCT/CN2020/099172 2020.06.30
- International Announcement: WO2022/000247A 2022.01.06
- Date entered country: 2020-08-11
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L23/31 ; H01L29/20 ; H01L29/205 ; H01L29/423 ; H01L29/66 ; H01L29/778

Abstract:
Some embodiments of the disclosure provide a semiconductor device. The semiconductor device comprises: a substrate; a first nitride semiconductor layer on the substrate; a second nitride semiconductor layer on the first nitride semiconductor layer and having a band gap greater than a band gap of the first nitride semiconductor layer; a group III-V dielectric layer disposed on the second nitride semiconductor layer; a gate electrode disposed on the second nitride semiconductor layer; and a first passivation layer disposed on the group III-V dielectric layer, wherein the group III-V dielectric layer is separated from the gate electrode by the first passivation layer.
Public/Granted literature
- US20220376064A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-11-24
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