Invention Grant
- Patent Title: Wiring member
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Application No.: US17756464Application Date: 2020-11-12
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Publication No.: US12021358B2Publication Date: 2024-06-25
- Inventor: Hironobu Yamamoto , Kyungwoo Kim , Toshinari Kobayashi , Moriyuki Shimizu , Yukitoshi Terasaka
- Applicant: Sumitomo Wiring Systems, Ltd.
- Applicant Address: JP Yokkaichi
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi
- Agency: Honigman LLP
- Priority: JP 19214103 2019.11.27
- International Application: PCT/JP2020/042244 2020.11.12
- International Announcement: WO2021/106599A 2021.06.03
- Date entered country: 2022-05-25
- Main IPC: H02G3/04
- IPC: H02G3/04 ; B60R16/02 ; H01B7/18 ; H02G3/38

Abstract:
An object is to further improve the reliability of a bent section of a linear transmission member. Provided is a wiring member including: a linear transmission member that includes a bent section; and a resin molded portion molded with a path holding portion of the linear transmission member being inserted thereinto, the path holding portion including the bent section, wherein recesses are formed so as to expose portions of the path holding portion other than a portion where tensile stress is concentrated due to bending, to the outside.
Public/Granted literature
- US20220416523A1 WIRING MEMBER Public/Granted day:2022-12-29
Information query
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