Invention Grant
- Patent Title: Radio frequency front-end module, manufacturing method thereof and communication device
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Application No.: US18200230Application Date: 2023-05-22
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Publication No.: US12022616B2Publication Date: 2024-06-25
- Inventor: Guojun Weng , Xiaolong Wang
- Applicant: Shenzhen Newsonic Technologies Co., Ltd.
- Applicant Address: CN Guangdong
- Assignee: Shenzhen Newsonic Technologies Co., Ltd.
- Current Assignee: Shenzhen Newsonic Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Leason Ellis LLP
- Priority: CN 2210985933.5 2022.08.17
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01L21/56 ; H01L23/00 ; H01L23/538 ; H01L25/00 ; H01L25/065 ; H05K1/11 ; H05K3/34 ; H05K3/40

Abstract:
A radio frequency front-end module, a manufacturing method thereof and a communication device are provided. The radio frequency front-end module includes a first base substrate and a metal bonding structure; a second functional substrate, including a second base substrate, a groove in the second base substrate, and a bonding metal layer; and a first radio frequency front-end component, at least partially located in the groove, the first base substrate and the second base substrate are oppositely arranged, and a surface of the second base substrate close to the first base substrate includes a groove surface inside the groove and a substrate surface outside the groove, and the bonding metal layer includes a first metal portion located on the groove surface and a second metal portion located on the substrate surface, the first radio frequency front-end component is at least partially surrounded by the first metal portion.
Public/Granted literature
- US20230292438A1 RADIO FREQUENCY FRONT-END MODULE, MANUFACTURING METHOD THEREOF AND COMMUNICATION DEVICE Public/Granted day:2023-09-14
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